From Molecular Modules to Modular Materials

Research report (imported) 2003 - Max Planck Institute of Colloids and Interfaces

Kurth, Dirk G.
Grenzflächen (Prof. Dr. Helmuth Möhwald)
MPI für Kolloid- und Grenzflächenforschung, Potsdam
The assembly of materials through weak competitive interactions and molecular modules provides fascinating opportunities for the development of key technologies for the 21st century. The utilization of weak intermolecular interactions for the controlled assembly of well-defined devices has become a central motive in nano-science and materials science. Here, several methods are presented that allow the spontaneous assembly of complex architectures. The integration of metal ions into the structures results in value adding functions, which are relevant for magnetic, optical and electronic applications. The modularity of this approach provides extensive control of structure and function from molecular to macroscopic length scales. In addition, the usage of structural and functional modules provides a maximum in flexibility and synthetic simplicity.

For the full text, see the German version.

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